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Semiconductor

Integrated circuits, or IC chips, are a complicated cornerstone of today's electronics. Modern IC chips incorporate an integrated circuit printed on a wafer and attached to the "package" containing electrical connections to the printed circuit board upon which the IC chip is soldered. The packaging for the IC chip also provides head transfer away from the wafer and, in some situations, a lead frame around the wafer itself.

When the IC chip contains a lead frame, the electrical connections on the wafer are bonded to the pads on the lead frame which is then bonded to the package.

Consistent bonding is imperative to the reliability and low failure rate of IC chips. In order to ensure a clean, long lasting, and electrically low resistant bond, many IC manufacturers utilize plasma technology to clean each point of contact before it is glued or soldered. Plasma treatment on semiconductors can substantially improve reliability.

Plasma Etch, Inc. has a history of working hand-in-hand with the semiconductor industry and is committed to providing unparalleled plasma treatment solutions for every possible application. Some of these applications include:

Cleaning
Removes contaminants and residue from material surfaces.

Bonding
Facilitates the direct bonding of materials.

Adhesion
Prepares surfaces for coating, painting, etc.

Polymerization
Enables polymerization via gaseous monomers.

Activation
Alters surface properties to create functional regions.