PE-75 Venus Plasma Asher

The fully automated PE-75 Venus has all the features of the standard PE-75 but includes advanced software and features for greater control over the plasma process. All Venus systems include computerized gas valves for highly accurate and repeatable gas flow rate control.

A laptop loaded with Plasma Etch, Inc. software is included for fully automatic system operation, multiple recipe storage, data logging/trending, events/alarms, and multi-step sequencing.

Additional features include mass flow controllers, dual sequence programming, as well as process data acquisition and archiving.


To purchase a PE-75 Venus, please contact us at (775) 883-1336 or email us at sales@plasmaetch.com.


Standard Features

Electrode Configuration

One Horizontal (9"Wx10"D + 5.5" Clearance)

Generator

400W 50KHz Continuously Variable Power Supply

Gas Control

Two 0-25cc/min Rotometers with Precision Needle Valves

Control System

A laptop loaded with Plasma Etch, Inc. software is included for fully automatic system operation, process sequencing, multiple recipe storage, and other advanced features

Vacuum Gauge

1-2000 mT

Vacuum Pump

5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)

Chamber Material

6061-T6 Aluminum

Chamber Dimensions

10.75” Deep x 10” Round

Unit Dimensions

18"x19"x24"

Unit Weight

90lbs

Vacuum Pump Weight

35lbs

Made in the U.S.A.

Note: High frequency units may have larger external dimensions, so check with your sales rep if your space is limited.

Optional Features

Temperature Control System

To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs

MHz Power Supplies with Automatic Matching Network

Higher watt/frequency power supplies

Dry Vacuum Pump

For more control over the process chamber pressure

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator

To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity

Additional Gas Inputs/Rotometers

Allows for more complex process gas combinations

Additional Digital Mass Flow Controllers

Provides digital automation and monitoring of process gases

Light Tower

For easy visualization of the steps of the plasma processing sequence

Facility Requirements

Electrical

120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A

Contact Us

Phone: 775-883-1336
Fax: 775-883-2559
E-mail: sales@plasmaetch.com

Office Hours: Weekdays 7:30 AM - 4:30 PM PST

Address: 3522 Arrowhead Drive
Carson City, Nevada, 89706 USA

Similar Systems

PE-75
PE-75

What is Plasma Ashing?

Plasma Ashing consists of etching ions around a surface to create patterns, such as when manufacturing a printed circuit board, a photoresist or etching mask is put on the treated surface to map out the ashing pattern.

Next, the photoresist needs to be removed from the surface. However, we don't want to remove any other part of the surface. The goal is to leave behind just the desired pattern on the surface of the material. This removal is what we call plasma ashing. This step is an important part of manufacturing printed circuit boards.

Treating a surface requires using oxygen (O2) in the vacuum chamber instead of lab air. The oxygen ionizes and becomes oxygen plasma which can be used to plasma ash the photoresist. This assists in the removal of the etching mask.