PE-100 Benchtop Plasma System
The PE-100 is a complete plasma treatment solution capable of reactive ion etching, plasma functionalization, and more. This model is perfect for manufacturers, medical facilities, universities, research facilities, or any other company in need of a cost-effective, production-grade plasma processing solution.
The convenient chamber size, along with the availability of high frequency RF power, combine to create a production capable unit small enough to fit nearly anywhere in your lab or production work space.
Full laptop control enables enhanced consistency and complexity of recipes. PC automation also provides ease of use on the production floor.
This model is available in one of three standard configurations:
1) Plasma Cleaning/Plasma Etching
2) Reactive Ion Etching (RIE)
3) Convertible Configuration - Includes both isotropic and anisotropic plasma processing in a single system. Removable tray configuration.
To purchase a PE-100, please contact us at (775) 883-1336 or email us at sales@plasmaetch.com.
Standard Features
Electrode ConfigurationThree Stacked Horizontal (9"Wx13"D + 3" Clearance) (Several optional configurations available)
Generator300W 100KHz Continuously Variable Power Supply
Control SystemA laptop loaded with Plasma Etch, Inc. software is included for fully automatic system operation, process sequencing, multiple recipe storage, and other advanced features
Gas ControlOne 0-50cc Mass Flow Controller
Vacuum Gauge1-2000 mT
Vacuum Pump8CFM 2-Stage Direct Drive Oil Pump with Oil Mist Coalescing Filter (Oxygen Service – Krytox Charged)
Chamber Material6061-T6 Aluminum
Chamber Dimensions12”x14.5”x12”
Unit Dimensions17"x28"x30"
Unit Weight160lbs
Vacuum Pump Weight68lbs
Made in the U.S.A.Optional Features
Most systems can be customized with a wide range of options including:
Custom Sized Vacuum Chamber, Number/Size of ElectrodesTo ensure your system is able to specifically meet your throughput requirements
Reactive Ion ElectrodesEnables reactive ion etching
MHz Power Supplies with Automatic Matching NetworkHigher watt/frequency power supplies
PC-based Control SystemFor fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.
Electrostatic ShieldingSignificantly increases process uniformity by eliminating excess etching at the outer bounds of the processed material
Temperature Control SystemTo maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs
Dry Vacuum PumpFor more control over the process chamber pressure
Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas GeneratorTo ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity
Vacuum Pump Oil Mist EliminatorCaptures oil from vacuum pump exhaust
Vacuum Pump Oil FiltrationFilters the vacuum pump oil down to a 3 micron level, increasing the longevity of the oil and the vacuum pump
Automatic Vacuum ControlProvides automation of the process chamber pressure
Additional Digital Mass Flow ControllersProvides digital automation and monitoring of process gases
Software Configurable Gas Steering MatrixDesigned to allow for up to 5 process gas inputs with 3 selectable at any time
Low Gas-Source AlarmNotification for when your process gas container needs replenished
Light TowerFor easy visualization of the steps of the plasma processing sequence
Fume ScrubberTo eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust
Facility Requirements
Electrical120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A
Compressed Air Service80-100PSI, 0.5CFM
Regulated Process Gases15PSI, 2-Stage Regulator
