MK-II Plasma Etching System
The MK-II plasma etching system offers technological advantages such as the unique combination of process temperature control and electrostatic shielding. Both work in harmony to produce the most consistent, most uniform, and most reliable etch rates obtainable across an entire board's surface.
The MK-II is an excellent choice for use in industrial clean room settings as a plasma etching system.
This system works very well for treating flexible circuits. Flexile circuits may be placed on the horizontal shelves to prevent movement and shorting between electrodes.
To purchase a MK-II, please contact us at (775) 883-1336 or email us at sales@plasmaetch.com.
Standard Features
Electrode ConfigurationDefault 24"Wx18"D (Several Optional Configurations) 6, 8, 12, 16 and 24-Shelf Systems Available
Generator1250W to 5000W - 13.56MHz Continuously Variable Power Supply with Automatic Matching Network
Gas ControlTwo 0-2000cc Mass Flow Controllers with Low Gas Source Alarm
Control SystemColor PLC-Based Touch Screen Control Interface; Stores Multiple Three-Step Recipes
Vacuum Gauge1-2000 mT
Vacuum Pump
29CFM - 56CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)
- with -
Two Point Vacuum Pump Purge System
3 Micron Oil Filtration System
Oil Mist Eliminator
- or -
56CFM Dry Pump
355CFM or 845CFM Blower Booster
6061-T6 Aluminum
Unit Dimensions66”x79”x26”
Additional FeaturesTemperature Control System
Made in the U.S.A.Optional Features
Most systems can be customized with a wide range of options including:
Custom Sized Vacuum Chamber, Number/Size of ElectrodesTo ensure your system is able to specifically meet your throughput requirements
Reactive Ion Etching ElectrodesEnables reactive ion etching
KHz/MHz Power Supplies with Automatic Matching NetworkHigher watt or different frequency power supplies
PC-based Control SystemFor fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.
Electrostatic ShieldingGreatly increases process uniformity across each shelf by eliminating excess etching at the outer bounds of the processed material
Temperature Control SystemTo maintain specific temperatures in the processing chamber for enhanced uniformity between shelves and application-specific needs
Dry and Oil-Driven Vacuum Pumps and Blower BoostersA variety of vacuum pump options for more control over the process chamber pressure
Chiller System for Dry Vacuum PumpNecessary for the operation of a dry vacuum pump
Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas GeneratorTo ensure thorough removal of contaminants from the etching system, providing uniformity and increasing longevity
Vacuum Pump Oil Mist EliminatorCaptures oil from vacuum pump exhaust
Vacuum Pump Oil FiltrationFilters the vacuum pump oil down to a 3 micron level which increases the longevity of the oil and the vacuum pump
Automatic Vacuum ControlProvides automation of the process chamber pressure
Additional Digital Mass Flow ControllersProvides digital automation and monitoring of process gases
Software Configurable Gas Steering MatrixDesigned to allow for up to 5 process gas inputs; up to 3 are selectable at any time by software driven controls
Low Gas-Source AlarmNotification for when your process gas container needs replenished
Light TowerFor easy visualization of the steps of the plasma processing sequence
Fume ScrubberTo eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust of the etching system
Facility Requirements
Electrical120/208 VAC, 50/60 Hz @ 50-100Amps, 3 Phase, 5 Wire
Compressed Air Service80-100PSI, 0.5CFM
Regulated Process Gases15-30PSI
CoolingCooling Water Source for RF Generator @ 2GPM
